Flexible thermal energy dissipating and light emitting diode mounting arrangement

ABSTRACT

A flexible thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a flexible thermally conductive sheet. The thermally conductive sheet defines a plurality of openings therethrough each sized to receive and securely hold therein a different one of the plurality of LEDs with the flexible thermally conductive sheet about the opening in physical, thermally conductive contact with the at least one side portion of the encapsulating material. The flexible thermally conductive sheet absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet. The flexible thermally conductive sheet is formable to direct radiation from the plurality of LEDs in multiple directions while securely holding each of the plurality of LEDs within a corresponding one of each of the plurality of openings.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This patent application claims priority to and the benefit of U.S.Provisional Patent Application Ser. No. 61/161,611, filed Mar. 19, 2009,the disclosure of which is incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to structures and techniques fordissipating thermal energy, and more specifically to structures andtechniques for dissipating thermal energy generated by current flow insemiconductor circuits.

BACKGROUND

In the operation of conventional semiconductor circuits, thermal energygenerated by current flow across one or more semiconductor junctionsresults in increased temperature of the junction, the semiconductormaterial surrounding the junction and also of the environmentsurrounding the semiconductor circuit. It is desirable to dissipate atleast some of the thermal energy generated as a result of such currentflow before such thermal energy results in an undesirable increase inthe temperature of the semiconductor material and its surroundingenvironment.

SUMMARY

The present invention may comprise one or more of the features recitedin the attached claims, and/or one or more of the following features andcombinations thereof. A flexible thermal energy dissipating and lightemitting diode (LED) mounting arrangement may comprise a plurality ofLEDs and a flexible thermally conductive sheet. Each of the plurality ofLEDs may include an LED circuit having a top surface from whichradiation is emitted in response to current flow through the LED circuitand an opposite bottom surface mounted to a mounting surface, andencapsulating material surrounding the LED circuit and the mountingsurface, the encapsulating material defining a top portion opposite thetop surface of the LED circuit, a bottom portion opposite the mountingsurface and at least one side portion extending between the bottomportion and the top portion. The flexible thermally conductive sheet maydefine a plurality of openings therethrough. Each of the plurality ofopenings may be sized to receive and securely hold therein a differentone of the plurality of LEDs with the thermally conductive sheet aboutthe opening in physical, thermally conductive contact with the at leastone side portion of the encapsulating material. The flexible thermallyconductive sheet may absorb thermal energy generated within each of theplurality of LEDs as a result of current flow through the LED circuitand reject the absorbed thermal energy to ambient. The flexiblethermally conductive sheet may be formable to direct radiation from theplurality of LEDs in multiple directions while securely holding each ofthe plurality of LEDs within a corresponding one of each of theplurality of openings.

The plurality of LEDs may comprise an m×n array of LEDs arranged on theflexible thermally conductive sheet, where m and n are positive integersand where m>1 and n>1.

Alternatively, the plurality of LEDs may comprise a p×1 array of LEDsarranged on the flexible thermally conductive sheet, where p is apositive integer and p>1.

The flexible thermally conductive sheet may comprise copper (Cu).Alternatively or additionally, the flexible thermally conductive sheetmay comprise aluminum (Al). Alternatively or additionally still, theflexible thermally conductive sheet comprises one or more of copper(Cu), Aluminum (Al), Gold (Au), Silver (Au), Magnesium (Mg), Tin (Sn),Zinc (Zn), Tungsten (W) and Beryllium (Be).

The flexible thermally conductive sheet may be formed of a materialhaving a thermal conductivity of at least 50 W/mK. Alternatively, theflexible thermally conductive sheet may be formed of a material having athermal conductivity of at least 200 W/mK.

The thermally conductive sheet may be separate from, and is notconnected to, the mounting surface.

The flexible thermally conductive sheet may be electrically isolatedfrom the LED circuit.

The flexible thermal energy dissipating and LED mounting arrangement mayfurther comprise a high surface emissivity coating applied to one ormore surfaces of the flexible thermally conductive sheet.

An interface may be defined between each of the plurality of openingsdefined through the flexible thermally conductive sheet and the at leastone side of the encapsulating material of a corresponding one of theplurality of LEDs. The flexible thermal energy dissipating and LEDmounting arrangement may further comprise a thermally conductive mediuminterposed in each of the interfaces. The thermally conductive mediummay facilitate transfer of the thermal energy from each of the pluralityof LEDs to the flexible thermally conductive sheet. The thermallyconductive medium may comprise at least one of a thermally conductivegrease and a thermally conductive bonding medium.

The LED circuit may define a semiconductor junction between the top andbottom surfaces thereof across which the current flows through the LEDcircuit. The semiconductor junction may define a plane that issubstantially parallel with the top and bottom surfaces of the LEDcircuit. The flexible thermally conductive sheet about each of theplurality of openings may be substantially aligned with the planedefined by the semiconductor junction of the LED circuit of each of acorresponding one the plurality of LEDs.

The flexible thermally conductive sheet about each of the plurality ofopenings may intersect an angle of less than or equal to a predefinedangle relative to the plane defined by the semiconductor junction of theLED circuit of each of a corresponding one of the plurality of LEDs.Illustratively, the predefined angle may be about 60 degrees.Alternatively, the predefined angle may be about 45 degrees.Alternatively still, the predefined angle may be about 15 degrees.Alternatively still, the predefined angle may be about zero degrees suchthat the plane defined by the semiconductor junction of the LED circuitof each of the plurality of LEDs substantially bisects the flexiblethermally conductive sheet about each corresponding one of the pluralityof openings defined through the flexible thermally conductive sheet.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of one illustrative embodiment of athermal energy dissipating arrangement for a semiconductor circuit.

FIG. 2 is a perspective view of the embodiment illustrated in FIG. 1.

FIG. 3 is a cross-sectional view of another illustrative embodiment of athermal energy dissipating arrangement for a semiconductor circuit.

FIG. 4 is a perspective view of the embodiment illustrated in FIG. 3.

FIG. 5 is a cross-sectional view of one illustrative embodiment of athermal energy dissipating arrangement for one example electricalcomponent including a semiconductor circuit.

FIG. 6 is a cross-sectional view of another illustrative embodiment of athermal energy dissipating arrangement for an electrical component ofthe type illustrated in FIG. 5.

FIG. 7 is a perspective view of yet another illustrative embodiment of athermal energy dissipating arrangement for an electrical component ofthe type illustrated in FIG. 5.

FIG. 8 is a cross-sectional view of still another illustrativeembodiment of a thermal energy dissipating arrangement for an electricalcomponent of the type illustrated in FIG. 5.

FIG. 9 is a front elevational view of one illustrative embodiment of athermal energy dissipating arrangement for a plurality of electricalcomponents generally of the type illustrated in FIG. 5, which thermalenergy dissipating arrangement also acts as a component mountingarrangement for the plurality of electrical components.

FIG. 10 is a perspective view of another illustrative embodiment of athermal energy dissipating arrangement for a plurality of electricalcomponents generally of the type illustrated in FIG. 5, which thermalenergy dissipating arrangement also acts as a component mountingarrangement for the plurality of electrical components.

FIG. 11 is a perspective view of the thermal energy dissipatingarrangement of FIG. 10 with a plurality of electrical components mountedthereto.

FIG. 12 is a top plan view of yet another illustrative embodiment of athermal energy dissipating arrangement for a plurality of electricalcomponents generally of the type illustrated in FIG. 5, which thermalenergy dissipating arrangement also acts as a component mountingarrangement for the plurality of electrical components.

FIG. 13A is a cross-sectional view of the embodiment shown in FIG. 12.

FIG. 13B is a cross-sectional view of the embodiment illustrated in FIG.12 with a first modified geometry of the thermal energy dissipatingarrangement.

FIG. 13C is a cross-sectional view of the embodiment illustrated in FIG.12 with a second modified geometry of the thermal energy dissipatingarrangement.

FIG. 13D is a cross-sectional view of the embodiment illustrated in FIG.12 with a third modified geometry of the thermal energy dissipatingarrangement.

FIG. 14 is a cross-sectional view of the embodiment illustrated in FIGS.12 and 13A illustrating the electrical component mounted to a number ofjuxtaposed thermal energy dissipating arrangements.

FIG. 15 is a plot of thermal energy dissipation medium surfacetemperature vs. distance from the surface of a light emitting diodecircuit.

DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS

For the purposes of promoting an understanding of the principles of theinvention, reference will now be made to a number of illustrativeembodiments shown in the attached drawings and specific language will beused to describe the same.

This patent application is related to the following U.S. PatentApplications, all of which claim priority to and the benefit of U.S.Provisional Patent Application Ser. No. 61/161,611, filed Mar. 19, 2009,and all of which were filed Mar. 19, 2010: (1) U.S. patent applicationSer. No. 12/727,990 now U.S. Pat. No. 8,168,990, entitled Apparatus ForDissipating Thermal Energy Generated By Current Flow In SemiconductorCircuits, (2) U.S. patent application Ser. No. 12/727,994, entitledThermal Energy Dissipating And Light Emitting Diode MountingArrangement, (3) U.S. patent application Ser. No. 12/728,011, entitledThermal Energy Dissipating Arrangement For A Light Emitting Diode, and(4) U.S. patent application Ser. No. 12/728,016 now U.S. Pat. No.8,115,229, entitled Arrangement For Dissipating Thermal Energy GeneratedBy A Light Emitting Diode.

Referring now to FIG. 1, a cross-sectional view of one illustrativeembodiment of a thermal energy dissipating arrangement 10 is shown for asemiconductor circuit 12. The semiconductor circuit 12 may include anynumber of semiconductor junctions defined between two dissimilarsemiconductor materials. The term “two dissimilar semiconductormaterials” is defined for purposes of this disclosure as twosemiconductors which differ in their concentration of electrons and/orholes. For example, so-called “P-type” and “N-type” semiconductormaterials are, for purposes of this disclosure, two dissimilarsemiconductor materials, and a conventional P-N junction therefore fallswithin the meaning of a semiconductor junction between two dissimilarsemiconductor materials. Other examples will occur to those skilled inthe art, and any such other examples are contemplated by thisdisclosure.

In the example illustrated in FIG. 1, a simple form of the semiconductorcircuit 12 is shown and includes a single semiconductor junction 15formed between a P-type semiconductor region or layer 14 and an N-typesemiconductor region or layer 16. In one illustrative implementation,which should not be considered to be limiting in any way, thesemiconductor circuit 12 illustrated in FIG. 1 is a conventional lightemitting diode (LED). It will be understood, however, that thesemiconductor circuit 12 may alternatively include any number ofsemiconductor regions or layers and any number of semiconductorjunctions formed therebetween.

In the illustrated example, a driver circuit 18 is electricallyconnected across the semiconductor circuit 12, e.g., between the P-typeregion 14 and the N-type region 16, such that current flow, I, throughthe semiconductor circuit 12 and across the semiconductor junction 15 isgenerally normal to a plane defined by the semiconductor junction 15.The driver circuit 18 may be a conventional driver circuit configured todrive the semiconductor circuit 12 from a conventional DC voltagesource. Alternatively, the driver circuit 18 may be a conventionaldriver circuit that may or may not include one or more of a conventionaltransformer, a conventional full-bridge rectifier circuit, aconventional half-bridge rectifier, or the like, and that is, in anycase, configured to convert an AC voltage from an AC voltage source to aDC voltage suitable for driving the semiconductor circuit 12.Alternatively still, the driver circuit 18 may be configured to drivethe semiconductor circuit 12 only during only one or the other one-halfcycle of an AC voltage produced by an AC voltage source such that theresulting drive voltage has a net DC value with an appropriate polarityto drive the semiconductor circuit 12.

The semiconductor circuit 12 is encapsulated in a conventionalencapsulating material 17, e.g., epoxy, resin-based material, or thelike. The encapsulating material 17 is in physical contact with the topsurface of the semiconductor layer 14, and also with each of the sidesof the semiconductor circuit 12. Although FIG. 1 shows the encapsulatingmaterial 17 also in physical contact with the bottom surface of thesemiconductor layer 16, it will be understood that this is forillustration purposes only, and that the bottom surface of thesemiconductor layer 16 in typical implementations will actually bephysically mounted to a conventional semiconductor mounting surface,e.g., a conventional lead frame or other suitable mounting surface. Insuch cases, the plane defined by the junction 15 illustrated in FIG. 1will be substantially parallel to the mounting surface of thesemiconductor circuit 12.

In embodiments in which the semiconductor circuit 12 is a light emittingdiode (LED), for example, the encapsulating material 17 may typically bea transparent or otherwise light transmissive epoxy material that curesto a hardened state and that is typically provided in a color thatmatches that of the radiation produced by the LED. For othersemiconductor circuits the encapsulating material may not be transparentor light transmissive and may be formed of other conventionalencapsulating materials. In any case, the encapsulating material is inphysical contact with, and surrounds the semiconductor circuit.

The thermal energy dissipating arrangement 10 illustrated in FIG. 1further includes a thermally conductive medium 20 positionedsubstantially opposite to the plane defined by the semiconductorjunction 15, and in physical contact with the encapsulating material 17opposite the junction 15. The thermally conductive medium 20illustratively defines an opening therethrough that extends completelyabout the periphery of the semiconductor circuit 12 substantiallyopposite to the plane defined by the semiconductor junction, as shownmost clearly in FIG. 2, although this disclosure contemplates that thethermally conductive medium 20 in some embodiments may only partiallysurround the semiconductor circuit 12. The thermally conductive medium20 has a thickness W, and lengths L1 and L2 on either side of thecombination of the semiconductor circuit 12 and encapsulating material17. L1 may be, but need not, be equal to L2. The thickness, W, at theopening defined through the thermal energy dissipating medium 20 definesa wall that physically contacts the outer surface of the encapsulatingmaterial. In some embodiments, the lengths L1 and/or L2 may be greateror even much greater than the thickness, W, and in other embodiments oneor both of the lengths L1 and L2 may be equal to or less than W.

Semiconductor materials are generally understood to comprise crystallinestructures that form crystal lattices. When current flows across asemiconductor junction formed between two dissimilar semiconductormaterials, thermal energy is transferred to the crystal lattice viavarious processes including, but not necessarily limited to,electron-hole pair generation and recombination, photon emission in thecase of light emitting diodes (LEDs), Peltier heating, electron-holescattering and the like. At least some of these energy transferprocesses result in localized heating of the crystal lattice whichincreases the temperature of the semiconductor circuit 12 particularlyin the vicinity of the junction 15. If this increase in thesemiconductor junction temperature is not adequately managed, the entiresemiconductor circuit 12 as well as the environment surrounding thesemiconductor circuit 12, i.e., the encapsulating material 17illustrated in FIG. 1, will likewise rise in temperature. Withoutadequate thermal energy management, thermal energy resulting from suchcurrent flow across the semiconductor junction 15 may result inexcessive heating of the entire semiconductor circuit 12 and itssurrounding environment.

As used in this disclosure, the term “thermal energy” is defined in thecontext of a semiconductor circuit 12 as energy that is transferred tothe semiconductor lattice when current flows across a semiconductorjunction between two dissimilar semiconductor materials. When suchthermal energy is transferred to the semiconductor lattice as a resultof current flow across a semiconductor junction as described above, atleast some of this thermal energy is directed outwardly from andparallel to the semiconductor junction in the form of heat fluxresulting from the corresponding rise in temperature of thesemiconductor junction 15. In the example embodiment illustrated inFIGS. 1 and 2, this thermal energy of the semiconductor device, TE_(SD),is thus depicted as being directed outwardly away from the semiconductorjunction 15 in all directions about the periphery of the semiconductorcircuit 12 through the encapsulating material 17 surrounding thesemiconductor circuit 12. The thermally conductive medium 20 extendingat least partially about the semiconductor circuit 12, at least aportion of which is positioned substantially opposite to the planedefined by the semiconductor junction 15, absorbs and dissipates atleast some of this thermal energy, TE_(SD), that would otherwise resultin heating of the entire semiconductor 12 and of the encapsulatingmaterial 17 surrounding the semiconductor circuit 12. It should be notedthat in FIG. 2, the encapsulating material 17 is omitted to illustratethe thermal energy, TE_(SD), that is directed outwardly away from thesemiconductor device 12 toward the thermal energy dissipating medium 20,and the lengths, L1 and L2 (as well as L3 and L4), of the thermal energydissipating medium 20 are truncated for ease of illustration.

Because this thermal energy, TE_(SD) that is directed outwardly from thesemiconductor device 12 from the plane defined by the semiconductorjunction 15 is absorbed and dissipated by the thermally conductivemedium 20, the temperature of the semiconductor circuit 12 and of theencapsulating material 17 surrounding the semiconductor circuit 12 canbe effectively managed. As will be described in greater detailhereinafter, the operating temperature of the semiconductor circuit 12and the surrounding encapsulating material 17 can be suitably controlledby appropriate choice the material used for the thermally conductivemedium 20, its placement relative to the semiconductor circuit 12, itsthickness and its total surface area.

Ideally, the thermally conductive medium 20 should have high thermalconductivity, i.e., should have a high ability to conduct heat. It isknown that metals having high electrical conductivity also generallyhave high thermal conductivity, and in this regard materials that workwell for the thermally conductive medium 20 include, but should not belimited to, one or any combination of, Silver (Ag), Copper (Cu), Gold(Au), Aluminum (Al), Brass, Bronze, Iron (Fe), Nickel (Ni), Zinc (Zn),Magnesium (Mg) and Tungsten (W). Non-metals having high thermalconductivity, such as diamond, zirconium and graphite, may also be used.However, practical considerations including, for example, but notlimited to, cost and availability, will typically influence the choiceof material(s) used for the thermally conductive medium 20. Thefollowing Table 1 sets forth the thermal conductivities of variousmaterials that may be suitable for use, either alone or in combination,as the thermal energy dissipating medium 20. It will be understood,however, that Table 1 sets forth only examples of materials that may beused, either alone or in combination with others, as the thermal energydissipating medium 20, and that other suitably high thermal conductivitymaterials that do not appear in Table 1 may be alternatively oradditionally used.

TABLE I Material Thermal Conductivity (W/mK) Diamond  900-2320 Silver(Ag) 429 Copper (Cu) 401 Gold (Au) 318 Aluminum (Al) 120-237 Tin (Sn) 66Steel 45 Lead (Pb) 35.3 Graphite >120 Brass 111-120 Bronze  26-106 Iron47-80 Nickel (Ni) 90 Zinc (Zn) 116 Magnesium (Mg) 160 Tungsten (W)162-173 Beryllium (Be) 218 Zirconium 250

It is generally desirable to select the thermal energy dissipatingmedium 20 for use with the semiconductor circuit 12 to have a thermalconductivity at least, i.e., greater than or equal to, about 50 W/mK,where W/mK is understood to mean Watts per meter—Kelvin, although higherthermal conductivity materials may additionally or alternatively beused. In some applications in which the semiconductor circuit 12 isimplemented in the form of a plurality of light emitting diodes, forexample, materials such as Cu and Al having thermal conductivities of atleast, i.e., greater than or equal to, 200 W/mK have been found to workwell as the thermal energy dissipating medium.

In some embodiments it may also be desirable for the thermallyconductive medium 20 to have a low coefficient of thermal expansion suchthat linear and/or volumetric expansion or movement of the thermallyconductive material over the range of operating temperatures is low.Relatively high thermally conductive materials that also have relativelylow thermal expansion coefficients include, but should not be limitedto, diamond, tungsten, steel, Nickel (Ni), Gold (Au), Copper (Cu),Silver (Ag), Brass, Aluminum (Al), Magnesium (Mg) and Zinc (Zn). In someembodiments, some examples of which will be described hereinafter, itmay further be desirable to utilize the thermally conductive medium 20also as the mounting and support structure for any number ofsemiconductor circuits 12, e.g., light emitting diodes. In this regard,a thermally conductive medium 20 formed of one or some combination of,for example, but not limited to, Copper (Cu), Aluminum (Al), Nickel(Ni), Magnesium (Mg), Zinc (Zn), Tungsten (W) and/or brass make goodchoices as strips, sheets, bands, etc. as such materials can not only bedimensioned to support a plurality of semiconductor circuits 12, e.g.,LEDs, they can also be made flexible or semi-flexible so as to beformable to any desired or target shape either before or after mountinga plurality of semiconductor circuits 12, e.g., LEDs, thereto so thatradiation emitted by the LEDs can be directed in multiple directions.

Generally, thermal energy is transferred from one place to another viaone or more of three basic mechanisms; (1) conduction, i.e., directthermal energy transfer through a solid, (2) convection, i.e., thermalenergy transfer via movement of a fluid, and (3) radiation, i.e.,thermal energy transfer via propagation of visible and non-visibleradiation. For purposes of this document, thermal energy transfer willbe described in terms of conventional heat transfer equations with thequantity of interest being “Q,” defined here as transferred heat inconventional units, e.g., Watts. Thus, the terms thermal energy transferand heat transfer, Q, will be used synonymously herein.

In the transfer of the thermal energy, TE_(SD), from the junction 15 ofthe semiconductor device 12 through the encapsulating material 17 towardthe thermal energy dissipating medium 20 as illustrated in FIGS. 1 and2, only two of the conventional heat transfer mechanisms are pertinent;namely, conduction and radiation. In terms of heat transfer, Q, the twoquantities of interest are thus the heat transferred from the junction15 of the semiconductor device or circuit 12 through the encapsulatingmaterial 17 toward the thermal energy dissipating medium 20 viaconduction, Q_(SDC), and the heat transferred from the junction 15 ofthe semiconductor circuit 12 through the encapsulating material 17toward the thermal energy dissipating medium 20 via radiation, Q_(SDR).The quantity Q_(SDC) is given by the conductive heat transfer equation:Q _(SDC)=2πkW(T _(J) −T _(TED))/In(R _(O) /R _(I))  (1),

where Q_(SDC) (Watts) is the heat transferred from the junction 15 ofthe semiconductor circuit or device 12 through the encapsulatingmaterial 17 toward the thermal energy dissipating medium 20 viaconduction, k (Watts/degree C-meter) is the thermal conductivity of theencapsulating material 17, W is the thickness of the thermal energydissipating material 20, T_(J) (degrees C.) is the temperature of thesemiconductor junction 15, T_(TED) (degrees C.) is the temperature ofthe outer periphery of the encapsulating material 17 across from thesemiconductor junction 15 (i.e., at the interface with the thermalenergy dissipating medium 20), R_(O) (meters) is the radius from thecenter of the semiconductor circuit 12 to the outer periphery of theencapsulating material 17 across from the semiconductor junction 15(i.e., at the interface with the thermal energy dissipating medium 20),and R_(I) is the radius from the center of the semiconductor circuit 12to the outer periphery of the semiconductor circuit 12. The dimensionalvariables W, R_(O) and R_(I) are illustrated in FIG. 1.

It should be noted that R_(I) will typically be an approximated value asmost semiconductor circuits 12 are either square or rectangular inshape. Moreover, the semiconductor circuit 12 will typically be mountedto a lead frame (not shown in FIG. 1), which if thermally bonded to thesemiconductor circuit 12, as is typically done, will necessarily becomepart of the heat source. For purposes of this disclosure, the term “heatsource” refers to a combination of the junction 15 of the semiconductordevice 12 where thermal energy is generated as a result of current flowacross the junction 15 as described hereinabove, and any portion of allsimilarly thermally conductive structures integral with and/orphysically connected, attached, mounted and/or bonded thereto that risesto within a threshold value of the operating temperature of thesemiconductor junction 15 resulting from current flow across thejunction 15. For example, the “heat source” in the context of theembodiment illustrated in FIG. 1 includes the junction 15 as well as theentirety of the integral semiconductor circuit 12. In embodiments inwhich the semiconductor circuit 12 is mounted to a lead frame, the “heatsource” includes the junction 15, the entirety of the integralsemiconductor circuit 12 and the lead frame to which the semiconductorcircuit 12 is mounted, assuming that the lead frame is a “similarlythermally conductive structure.” For purposes of this disclosure, theterm “similarly thermally conductive structure” refers to any structurehaving a thermal conductivity that is sufficiently close to that of thesemiconductor circuit 12 and that is at least an order of magnitudegreater than that of the material or environment surrounding suchstructure(s). Any approximation of R_(I) in embodiments that includesuch a lead frame or other thermally conductive structure(s) to whichthe semiconductor circuit 12 is mounted may therefore need to take intoaccount the dimensions and/or geometry of such a lead frame or otherthermally conductive structure(s).

It should further be noted with respect to equation (1) that as thedistance between the semiconductor circuit 12 and the outer periphery ofthe encapsulating material 17 decreases, the ratio R_(O)/R_(I) becomessmaller and the conductive thermal energy transferred from the heatsource to the outer periphery of the encapsulating material 17accordingly increases proportionally to 1/In(R_(O)/R_(I)). Likewise, asthe width of the thermal energy dissipating medium 20 increases, theconductive thermal energy transferred from the heat source to the outerperiphery of the encapsulating material 17 proportionally increases.However, if the position of the thermal energy dissipating medium 20 isnot directly opposite to the semiconductor junction 15, e.g., and isinstead positioned above or below the semiconductor circuit 12, theratio R_(O)/R_(I) increases by a factor of cos θ, where θ is the anglebetween the plane defined by the junction 15 of the semiconductorcircuit 12 and the center of the thermal energy dissipating medium 20.

It should also be noted that the transfer of thermal energy viaconduction according to equation (1) requires physical, thermallyconductive contact between the thermal energy dissipating medium 20 andthe encapsulating material 17 so that thermal energy can be effectivelytransferred through the interface between the two via conduction. Inthis regard, the term “physical, thermally conductive contact” betweenthe thermal energy dissipating medium 20 and the encapsulating material17 means that the thermal energy dissipating medium 20 and the outerperiphery of the encapsulating material 17 fit tightly together in aphysically contacting relationship such that thermal energy isefficiently transferred from the outer periphery of the encapsulatingmaterial 17 to the thermal energy dissipating medium 20 through theinterface between these two structures, and/or that one or moreadditional thermally conductive medium(s) is/are interposed in theinterface between the thermal energy dissipating medium 20 and theencapsulating material 17. Examples of such additional thermallyconductive media include, but are not limited to, any one or combinationof conventional thermally conductive greases and conventional thermallyconductive bonding media such as conventional conductive adhesives,thermally conductive epoxies, or the like. In any case, the additionalthermally conductive media, in embodiments that include such additionalthermally conductive media, acts to facilitate the transfer of thermalenergy from the outer periphery of the encapsulating material 17 to thethermal energy dissipating medium 20.

In the transfer of the thermal energy, TE_(SD), from the heat sourcewithin the encapsulating material 17 through the encapsulating material17 and toward the thermal energy dissipating medium 20 as illustrated inFIGS. 1 and 2, the quantity Q_(SDR) is given by the radiative heattransfer equation:Q _(SDR) =F _(SD-TED) A _(SDS)σε(T _(J) ⁴ −T ⁴ _(TED))  (2),

where Q_(SDR) (Watts) is the heat transferred from the heat sourcethrough the encapsulating material 17 toward the thermal energydissipating medium 20 via radiation, F_(SD-TED) (dimensionless) is the“view factor” from the thermal energy emitting surface(s) of the heatsource, i.e., the sides, of the semiconductor circuit 12 and includingthe geometry of any thermally conductive structure(s) attached,connected, mounted and/or bonded thereto, to the thermal energyabsorbing surface of the thermal energy dissipating medium 20, A_(SDS)(meters) is the area of the thermal energy emitting surface(s) of theheat source, σ is the Stefan-Boltzmann constant (5.6704×10⁻⁸ W m⁻² K⁻⁴),ε is the surface emissivity of the thermal energy emitting surface(s) ofthe heat source, T_(J) (K) is the temperature of the semiconductorjunction 15 and T_(TED) (K) is the temperature of the outer periphery ofthe encapsulating material 17 across from the thermal energy emittingsurface(s) of the heat source (i.e., at the interface of theencapsulating material 17 and the thermal energy dissipating medium 20).The view factor, F_(SD-TED), depends generally upon the shapes of thethermal energy emitting and absorbing surfaces, and view factorequations and/or values for various geometrical shapes are available inpublished literature. As one example, the view factor between twodifferential areas dA₁ and dA₂ is given by dF_(d1-d2)=[cos θ₁ cosθ₂/πS²]dA₂, where θ₁ is the angle between surface 1 normal and astraight line between the two areas, θ₂ is the angle between surface 2normal and a straight line between the two areas, and S is the distancebetween the elements. Relating this equation back to equation 2, it canbe generally concluded that radiative thermal energy transfer betweentwo objects becomes greater as the distance S becomes less and also asθ₁ and θ₂ both approach zero, i.e., when the two surfaces are parallel.Conversely, as the two surfaces are moved apart from each other, theradiative thermal energy transfer between them drops proportionally to1/S², and as the two surfaces move away from a parallel relationshiprelative to each other the radiative heat transfer between them dropsproportionally to cos θ₁ and cos θ₂.

The heat transfer variables Q_(SDC) and Q_(SDR) are additive so that thetotal thermal energy, TE_(SD), transferred from the heat source withinand through the encapsulating material 17 to the thickness, W, of thethermal energy dissipating medium 20 is given by the sum of equations(1) and (2) to yield:TE _(SD)=2πkW(T _(J) −T _(TED))/In(R _(O) /R _(I))+F _(SD-TED) A_(SDS)σε(T _(J) ⁴ −T ⁴ _(TED))  (3).

Dissipation by the thermal energy dissipating medium 20 of the thermalenergy absorbed from the heat source through the encapsulating material17 occurs via rejection of the absorbed thermal energy in the form ofheat rejected by the thermal energy dissipating medium 20 to the ambientsurroundings, i.e., to the ambient environment surrounding the thermalenergy dissipating medium 20, from the surface area of the thermalenergy dissipating medium 20 that extends radially away from the openingin the thermal energy dissipating medium defined by the thickness, W,and that is exposed to the ambient environment. In the exampleembodiment illustrated in FIGS. 1 and 2, the thermal energy absorbed bythe thermal energy dissipating medium 20, TE_(TD), is thus depicted asbeing rejected outwardly away from every surface of the thermal energydissipating medium 20 that is exposed to the ambient environmentsurrounding the thermal energy dissipating medium 20. In this heatrejection process, again only two of the conventional heat transfermechanisms are pertinent; this time convection and radiation. In termsof heat transfer, Q, the two quantities of interest are thus the heattransferred from the thermal energy dissipating medium 20 to ambient viaconvection, Q_(TDC), and the heat transferred from the thermal energydissipating medium 20 to ambient via radiation, Q_(TDR). The quantityQ_(TDC) is given by the convective heat transfer equation:Q _(TDC) =A _(S) h(T _(S) −T _(AMB))  (4),

where Q_(TDC) (Watts) is the heat transferred by the thermal energydissipating medium 20 to ambient via convection, A_(S) (m²) is thesurface area of the thermal energy dissipating medium 20, h (Watts/m²C)is the convective film coefficient of the thermal energy dissipatingmedium 20, T_(S) is the surface temperature of the thermal energydissipating medium 20 and T_(AMB) is the temperature of the ambientenvironment surrounding the thermal energy dissipating medium 20. Theconvective film coefficient, h, represents the thermal resistance of arelatively stagnant layer of fluid between the thermal energydissipating medium 20 and the fluid medium, which in the embodimentillustrated in FIGS. 1 and 2 is air. Values of h for air dependsprimarily on the shape of the thermal energy dissipating medium 20, andh values for standard geometric shapes can be found in publiclyavailable literature. Alternatively or additionally, the convective filmcoefficient, h, for air can be computed using known equations andrelationships. The surface area, A_(S), of the thermal energydissipating medium 20 is the total area of the thermal energydissipating medium 20 that is exposed to the ambient environmentsurrounding the thermal energy dissipating medium 20. In the embodimentillustrated in FIG. 2, for example, L1=L2=L3=L4, and the total surfacearea of the thermal energy dissipating medium isA_(S)=4L1L5+4L1L6+2WL5+2WL6. It will thus be appreciated that three ofthe four sides of the thermal energy dissipating medium 20 reject heatto the ambient environment surrounding the thermal energy dissipatingmedium 20, with the surface of the thermal energy dissipating medium 20that is in contact with the encapsulating material 17 being the onlyside that does not. Any one or more of the lengths L1-L6 may vary aboutthe periphery of the thermal energy dissipating medium 20 or mayalternatively be substantially constant. Similarly, the thickness, W, ofthe thermal energy dissipating medium 20 may be substantially constantacross all lengths, or may alternatively vary across any one or more ofthe lengths L1-L6.

In the transfer of the thermal energy, TE_(TD), from the thermal energydissipating medium 20 to ambient as illustrated in FIG. 1, the quantityQ_(TDR) is given by the radiative heat transfer equation:Q _(TDR) =A _(S) σε(T _(S) ⁴ −T ⁴ _(AMB))  (5),

where Q_(TDR) (Watts) is the heat transferred from the thermal energydissipating medium 20 to ambient via radiation, A_(S) (m²) is the totalsurface area of the thermal energy dissipating medium 20 that is exposedto the ambient environment surrounding the thermal energy dissipatingmedium 20, σ is the Stefan-Boltzmann constant (5.6704×10⁻⁸ W m⁻² K⁻⁴), εis the surface emissivity of the thermal energy dissipating medium 20,T_(S) (K) is the surface temperature of the thermal energy dissipatingmedium 20 and T_(AMB) (K) is the temperature of the ambient environmentsurrounding the thermal energy dissipating medium 20. It will be notedthat equation (5) is identical in form to equation (2), except that theview factor has been omitted, which is typical for surfaces with acompletely unobstructed line-of-sight to its ambient surroundings. Inembodiments in which this is not the case, the view factor can be addedto equation (5), and values of the view factor can be determined asdescribed hereinabove with respect to equation (2).

The heat transfer variables Q_(TDC) and Q_(TDR) are additive so that thetotal thermal energy, TE_(TD), transferred from the thermal energydissipating medium 20 to ambient is given by the sum of equations (4)and (5) to yield:TE _(TD) =A _(S) h(T _(S) −T _(AMB))+A _(S) σε(T _(S) ⁴ −T ⁴_(AMB))  (6).

It should be noted that the thermal energy, TE_(TD), transferred fromthe thermal energy dissipating medium 20 to ambient is directlyproportional to both the total surface area, A_(S), of the thermalenergy dissipating medium 20 that is exposed to ambient and the surfaceemissivity, ε, of the thermal energy dissipating medium 20. The totalamount of heat that can be rejected by the thermal energy dissipatingmedium 20 to ambient can thus be increased by increasing the totalsurface area, A_(S), of the thermal energy dissipating medium that isexposed to ambient. This may be done, for example, by increasing thelengths L1 and/or L2 of the thermal energy dissipating medium, such asby adding one or more extended and/or folded edges to either or both ofL1 and L2, by adding one or more fin structures to L1 and/or L2, bydrilling holes into the surface of the thermal energy dissipating medium20, or the like. The total amount of heat that can be rejected by thethermal energy dissipating medium 20 to ambient can also be increased byincreasing surface emissivity of the thermal energy dissipating medium20, such as by coating one or more of the exposed surfaces of thethermal energy dissipating medium 20 with a known high surfaceemissivity coating.

Equation (6) represents an approximation of the rejected heat, TE_(TD),in which the surface temperature, T_(S), of the thermal energydissipating medium 20 is assumed to be constant across the surface area,A_(S). While this is not strictly true and the surface temperature,T_(S), actually varies across the surface of the thermal energydissipating medium, it is an acceptable approximation as long as thethermal conductivity, k (W/mK) is sufficiently high. Referring to FIG.15, for example, a plot is shown of surface temperature, T_(S), of thethermal energy dissipating medium 20 as a function of the distance fromthe side surface of the heat source, i.e., the side of the semiconductorcircuit 12, in an embodiment in which the heat source is a lightemitting diode (LED) circuit, the thermal energy dissipating medium 20is a sheet or strip having lengths L1 and L2 that are both greater thanthe width W (see, for example, any of FIGS.) and in which W=1 mm. Theline 200 represents an ideal thermal energy dissipating medium 200,i.e., with infinite or near-infinite thermal conductivity, and in theideal case the surface temperature, T_(S), of the thermal energydissipating medium 20 is constant across the surface area, A_(S). It isthis ideal case on which equation (6) is based. The line 202 representsa thermal energy dissipating medium 20 having a thermal conductivityk=400 W/mK, which is representative of copper (see Table 1). The line204 represents a thermal energy dissipating medium 20 having a thermalconductivity k=50 W/mK, and the line 206 represents a thermal energydissipating medium having a thermal conductivity k=10 W/mK. It should beapparent from FIG. 15 that as the thermal conductivity, k, of thethermal energy dissipating medium 20 decreases, so too does the accuracyof equation (6). Thus, high conductivity values, such as in excess of 50W/mK and certainly those in excess of 200 W/mK, not only enable goodheat conduction by the thermal energy dissipating medium, but such highvalues also acceptably allow for a simplified form of equation (6) asset forth above. For conductivity values less than 50 W/mK, not only isheat conduction by the thermal energy dissipating medium generallyunacceptably low, such low values further require a more complicationform of equation (6) to account for surface temperature differencesabout and along the surface area, A_(S), of the thermal energydissipating medium 20.

Equations (3) and (6), while useful for describing the transfer ofthermal energy from within and through the encapsulating material 17toward the outer periphery of the encapsulating material 17 (equation(3)) and for describing the transfer of thermal energy from the thermalenergy dissipating medium 20 to ambient (equation (6)), can also be usedto determine one or more thermal energy design parameters required tomeet one or more operating parameter goals. As one example, by settingequation (3) equal to equation (6) and entering into these equationsvalues for the known variables (i.e., variables that can be calculatedbased on other operating conditions), an approximation of the totalsurface area, A_(S), for a given thickness, W, of the thermal energydissipating medium 20 required to maintain a target thermal energydissipating medium surface temperature can be calculated. With the totalsurface area, A_(S), thus known, the particular shape and thickness ofthe thermal energy dissipating medium 20 can be designed that issuitable for the particular application. In such calculations, thejunction temperature, T_(J), of the semiconductor device 12 may bederived using known relationships from the magnitude of the drivecurrent used to drive the semiconductor device 12. If the ambienttemperature or temperature range can be estimated or otherwisedetermined, the remaining variables are measurable quantities, leavingonly A_(S) and W to solve for. Manipulating either or both of equations(3) and (6) to determine other useful design parameters will occur tothose skilled in the art, and the determination of any such other usefuldesign parameters is contemplated by this disclosure.

Referring now to FIGS. 3 and 4, another illustrative embodiment of athermal energy dissipating arrangement 10′ is shown for a semiconductorcircuit 12′. In this embodiment, the semiconductor 12′ includes a P-typesemiconductor region or layer 22, an N-type semiconductor region orlayer 24 formed on top of the region or layer 22, and a number of P-typeregions or layers 26 and 28 extending into the top surface of the N-typeregion or layer 24. The P-type regions 26, 28 and the N-type region 24together form a conventional “lateral” PNP transistor. An emitter 26 ofthe transistor is electrically connectable to a voltage V1 produced by adriver circuit 18′, a collector 28 of the transistor is electricallyconnectable to an electrical load and a base 24 of the transistor iselectrically connectable to a voltage V2 produced by the driver circuit18′. When V1 is sufficiently above V2, a current, I, flows laterallyfrom the emitter 28 to the collector 28 in a conventional manner.Current flow, I, through the semiconductor circuit 12′ and across thesemiconductor junctions defined between the emitter 26 and collector 28is generally normal to a plane defined by the semiconductor junction 15,and thermal energy directed outwardly from the semiconductor circuit 12′due to such current flow is oriented upwardly away from the top surfaceof the semiconductor circuit 12′ and into the encapsulating material 17′as illustrated in FIG. 3. Accordingly, the thermally conductive medium20′ in this embodiment is positioned substantially opposite to the planedefined by the semiconductor junctions defined between the emitter 26and the collector 28, i.e., above the top surface of the semiconductorcircuit 12′ and in physical, thermally conductive contact with the uppersurface of the encapsulating material 17′. The thermally conductivemedium 20′ illustratively extends completely over the top surface of thesemiconductor circuit 12′ in physical, thermally conductive contact withthe encapsulating material 17′ substantially opposite to the planedefined by the semiconductor junctions defined between the emitter 26and the collector 28, as shown most clearly in FIG. 4, although thisdisclosure contemplates that the thermally conductive medium 20′ in someembodiments may extend over only part of the top surface of thesemiconductor circuit 20′. It will be understood that with semiconductorcircuits that include one or more semiconductor junctions across whichcurrent flows laterally and vertically, a suitable thermally conductivemedium may extend at least partially about the periphery of thesemiconductor circuit and at least partially over the semiconductorcircuit.

Referring now to FIG. 5, a cross-sectional view is shown of oneillustrative embodiment of a thermal energy dissipating arrangement forone example electrical component 100 including a semiconductor circuit102. In the illustrated embodiment, the electrical component 100 is alight emitting diode (LED) device including a semiconductor LED circuit102 having a bottom surface 101 mounted to and in electrical contactwith a mounting surface in the form of the tope portion of oneelectrically conductive lead 104 extending from the electrical component100. The opposite top surface 103 of the LED circuit 102 emits radiationin response to current flow through the LED circuit 102 in aconventional manner. The top surface 103 of the semiconductor LEDcircuit 102 is also electrically connected via a conventional bond wire106 to another electrically conductive lead 108 extending from theelectrical component 100. It will be understood that the semiconductorLED circuit 102 includes a semiconductor junction as illustrated in FIG.1 that is parallel with the mounting surface of the electricallyconductive lead 104, although this junction is not specificallyillustrated in FIG. 5.

The semiconductor LED circuit 102, the bond wire 106 and portions of theelectrically conductive leads 104 and 108, including the mountingsurface of the electrically conductive lead 104, are encapsulated andsurrounded in a conventional LED encapsulating or potting material 110.The encapsulating material 110 defines a top portion 105 generallyopposite to the top surface 103 of the LED circuit 102, a bottom portion107 opposite to the mounting surface of the electrically conductivelead, and at least one side portion 109 extending between the top andbottom portions 105 and 107 respectively. In the embodiment illustratedin FIG. 5, the encapsulating material 110 of the LED 100 has a generallycircular cross-section between the top portion 105 and the bottomportion 107, and in this embodiment the encapsulating material has onlya single, circular side 109. However, this disclosure contemplates otherLED embodiments in which the encapsulating material 110 has more thanone side, and it would be a mechanical step to adapt the thermal energydissipation arrangement illustrated and described in this disclosure toany such other LED embodiments.

In the embodiment illustrated in FIG. 5, the thermally conductive medium112 is provided in the form of a ring or band that is embedded in theencapsulating material 110. The ring or band 112 is illustrativelyspaced apart from the semiconductor LED circuit 102 and extendscompletely about the periphery of the semiconductor circuit 102.Alternatively, the ring or band 112 may extend less than completelyaround the semiconductor LED circuit 102. In any case, at least aportion of the band or ring 112 is positioned substantially opposite tothe plane defined by at least one semiconductor junction of thesemiconductor LED circuit 102, and is electrically isolated from the LEDcircuit 102.

Referring now to FIG. 6, a cross-sectional view of another illustrativeembodiment of a thermal energy dissipating arrangement for anotherexample electrical component 100′ including the semiconductor circuit102. In the illustrated embodiment, the electrical component 100′ is alight emitting diode (LED) device as described with respect to FIG. 5,but without a thermally conductive band or ring embedded in theencapsulating or potting material 110. Rather, in the embodimentillustrated in FIG. 6, the thermally conductive medium 114 is providedin the form of a ring or band or plate that extends at least partiallyabout, and in physical, thermally conductive contact with, an outersurface of the side 109 of the encapsulating material 110. The ring orband or plate 114 is illustratively spaced apart from the semiconductorLED circuit 102 and extends completely about the outer surface of theencapsulating or potting material 110. Alternatively, the ring or band114 may extend less than completely around the outer surface of theencapsulating or potting material 110. In any case, at least a portionof the band or ring 114 is positioned substantially opposite to theplane defined by at least one semiconductor junction of thesemiconductor LED circuit 102. The outer diameter of the ring or band orplate may be selected to achieve one or more thermal energy dissipatinggoals. Referring to FIG. 7, for example, an example electrical component100″ is illustrated in which the thermally conductive medium 114′ isprovided in the form of a concentric plate 114′ having an outer diameterthat is sized to achieve one or more thermal energy dissipating goals,e.g., to effectively absorb thermal energy from the device 100″ andeffectively reject thermal energy to the ambient surrounding the plate114′. The concentric plate 114′ has an inner diameter 113 that is sizedto fit tightly against the outer periphery of the encapsulating material110 to thereby form physical, thermally conductive contact between theinner diameter of the concentric plate 114′ and the outer periphery ofthe encapsulating material 110 such that the concentric plate 114′defines an annular ring. In one embodiment, the concentric plate 114′may be provided in the form of a conventional washer formed from any oneor more known materials that may include, but should not be limited to,one or more of the materials listed in Table 1 above. It will beunderstood that the concentric shape of the outer periphery of the plate(or washer) 114′ illustrated in FIG. 7 is provided only for illustrativepurposes, and that the outer periphery of the plate (or washer) 114′ mayalternatively be provided in any desired geometric shape.

Referring now to FIG. 8, a cross-sectional view of yet anotherillustrative embodiment of a thermal energy dissipating arrangement foranother example electrical component 100′″ including the semiconductorcircuit 102. In the illustrated embodiment, the electrical component100″ is a light emitting diode (LED) device as described with respect toFIGS. 5 and 6, but without a thermally conductive band or ring or plateembedded in the encapsulating or potting material 110 or extending atleast partially about an outer surface of the encapsulating or pottingmaterial 110. Rather, in the embodiment illustrated in FIG. 8, thethermally conductive medium 114 is provided in the form of thermallyconductive particles 116 intermixed with at least a portion of theencapsulating or potting material 110′. In one embodiment, for example,the thermally conductive particles 116 are provided in the form of athermally conductive powder. Alternatively or additionally the thermallyconductive particles 116 may be provided in the form of loose, groundmedium prepared by, for example, grinding and/or shaving a solid form ofthe thermally conductive medium. In any case, the thermally conductiveparticles 116 extend at least partially about the semiconductor LEDcircuit 102, and may further be intermixed with the entire encapsulatingor potting material 110′ as illustrated in FIG. 8. In any case, at leasta portion of the thermally conductive particles 116 is positionedsubstantially opposite to the plane defined by at least onesemiconductor junction of the semiconductor LED circuit 102.

Referring now to FIG. 9, a front elevational view is shown of oneillustrative embodiment of a thermal energy dissipating arrangement 120for a plurality of electrical components 130 generally of the typeillustrated in FIGS. 5-7. In the illustrated embodiment, the thermalenergy dissipating arrangement 120 acts not only as a thermal energydissipating medium as described hereinabove, but also acts as acomponent mounting arrangement for the plurality of electricalcomponents 130. The plurality of electrical components 130 are generallyof the type illustrated in FIGS. 5-7, but instead of the singlethermally conductive ring or band or plate 114, an array 140 consistingof a plurality of interconnected rings or bands is provided. The array140 defines a plurality of rings or bands 142 ₁, 142 ₂, 142 ₃, . . .each sized to receive therein a different one of the plurality ofelectrical components. Each of the plurality of rings or bands 142 ₁,142 ₂, 142 ₃, . . . is interconnected to adjacent rings or bands bythermally conductive interconnecting members 144 ₁, 144 ₂, 144 ₃, 144 ₄,etc. Illustratively, the rings or bands 142 ₁, 142 ₂, 142 ₃, . . . aresized to receive and hold a different one of the electrical components130 therein to provide not only a thermal energy dissipating mechanismfor each of the plurality of electrical components 130, but also amounting structure for the plurality of electrical components 130. Eachof the plurality of rings or bands 142 ₁, 142 ₂, 142 ₃, . . .illustratively extend completely about outer surface of a correspondingone of the electrical components 130. Alternatively, one or more of theplurality of rings or bands 142 ₁, 142 ₂, 142 ₃, . . . may extend lessthan completely around corresponding ones of the plurality of electricalcomponents 130. In any case, at least a portion of each of the pluralityof bands or rings 142 ₁, 142 ₂, 142 ₃, . . . is positioned substantiallyopposite to the plane defined by at least one semiconductor junction ofeach corresponding semiconductor LED circuit 102.

Referring now to FIGS. 10 and 11, a perspective view is shown of anotherillustrative embodiment of a thermal energy dissipating arrangement 150for a plurality of the electrical components generally of the typeillustrated in FIGS. 5-7 (e.g., light emitting diodes or LEDs), and thatalso acts as a component mounting arrangement for the plurality ofelectrical components, e.g., 156 ₁-156 ₉. In the illustrated embodiment,the thermal energy dissipating arrangement 150 acts not only as athermal energy dissipating medium as described hereinabove, but alsoacts as a component mounting arrangement, i.e., an electrical componentcarrier, for the plurality of electrical components, e.g., 156 ₁-156 ₉.The plurality of electrical components 156 ₁-156 ₉ are generally of thetype illustrated in FIGS. 5-7, but instead of the single thermallyconductive ring or band 114 a thermally conductive sheet 152 consistingof a plurality of openings 154 ₁-154 ₉ is provided. The sheet 152 has alength, L_(SH), (which is shown truncated in FIG. 10), a width, W_(SH),and a thickness, TH_(SH). Generally, the length, L_(SH), and Width,W_(SH), are both greater than the thickness, TH_(SH), and, dependingupon the number of electrical components mounted thereto, the length,L_(SH), and Width, W_(SH), may either or both be much greater than thethickness, TH_(SH). Each of the plurality of openings 154 ₁-154 ₉ isillustratively sized to receive and securely hold therein a differentone of the plurality of electrical components 156 ₁-156 ₉ to provide notonly a thermal energy dissipating mechanism for each of the plurality ofelectrical components 156 ₁-156 ₉, but also a mounting and carryingstructure for the plurality of electrical components 156 ₁-156 ₉, suchthat the sheet 152 acts as a combination thermal energy dissipationmedium and electrical component carrier. At least a portion of each ofthe plurality of openings 154 ₁-154 ₉ is illustratively positionedsubstantially opposite to the plane defined by at least onesemiconductor junction of each corresponding semiconductor LED circuit102. The inner diameters of the openings 154 ₁-154 ₉ are sized to fittightly against the outer peripheries, i.e., exterior surface, of theside(s) of the encapsulating material 110 of the various electricalcomponents 156 ₁-156 ₉ to thereby form physical, thermally conductivecontact between the walls defined by the inner diameters of the openings154 ₁-154 ₉ and the outer peripheries, i.e., exterior surface, of theside(s) of the electrical components 156 ₁-156 ₉. The thermallyconductive sheet 152 may be formed of any one, or combination, ofthermally conductive materials of the type described hereinabove. Itwill be understood that while FIGS. 10 and 11 show a thermal energydissipating arrangement 150 for receiving and holding 9 LEDs, thisdisclosure contemplates embodiments of the thermal energy dissipatingarrangement 150 that is configured to receive and hold more or fewerLEDs or other semiconductor-based electrical components. In any case, asdescribed hereinabove with respect to FIG. 1, one or more additionalthermally conductive media may be interposed in the interface betweenany one or more of the openings 154 ₁-154 ₉ and the outer peripheries ofthe electrical components 156 ₁-156 ₉. Examples of such additionalthermally conductive media include, but are not limited to, any one orcombination of conventional thermally conductive greases andconventional thermally conductive bonding media such as conventionalconductive adhesives, thermally conductive epoxies, or the like.

Referring now to FIG. 12, a top plan view is shown of yet anotherthermal energy dissipating arrangement 160 for a plurality of theelectrical components generally of the type illustrated in FIGS. 5-7(e.g., light emitting diodes or LEDs), and that also acts as a componentmounting arrangement, i.e., an electrical component carrier, for aplurality of electrical components, e.g., 166 ₁-166 ₅. The plurality ofelectrical components 166 ₁-166 ₅ are generally of the type illustratedin FIGS. 5-7, but instead of the single thermally conductive ring orband 114 a thermally conductive strip 162 consisting of a plurality ofopenings 164 ₁-164 ₅ is provided. The strip 162 has a length, L_(ST),(which is shown truncated in FIG. 12), a width, W_(ST), and a thickness,TH_(ST). Generally, the length, L_(ST), and Width, W_(ST), are bothgreater than the thickness, TH_(ST), and, depending upon the number ofelectrical components mounted thereto, the length, L_(ST), and/or Width,W_(ST), may either or both be much greater than the thickness, TH_(ST).Each of the plurality of openings 164 ₁-164 ₅ is illustratively sized toreceive and securely hold therein a different one of the plurality ofelectrical components 166 ₁-166 ₅ to provide not only a thermal energydissipating mechanism for each of the plurality of electrical components166 ₁-166 ₄, but also a mounting and carrying structure for theplurality of electrical components 166 ₁-166 ₄. At least a portion ofeach of the plurality of openings 164 ₁-164 ₅ is positionedsubstantially opposite to the plane defined by at least onesemiconductor junction of each corresponding semiconductor LED circuit102. The inner diameters of the openings 164 ₁-164 ₅ are sized to fittightly against the outer peripheries, i.e., the exterior surface, ofthe side(s) of the encapsulating material 110 of the various electricalcomponents 166 ₁-166 ₅ to thereby form physical, thermally conductivecontact between the inner diameters of the openings 164 ₁-164 ₅ and theouter peripheries, i.e., the exterior surface, of the side(s) of theelectrical components 166 ₁-166 ₅. The thermally conductive strip 162may be formed of any one, or combination, of thermally conductivematerials of the type described hereinabove. It will be understood thatwhile FIG. 12 shows a thermal energy dissipating arrangement 160 forreceiving and holding 5 LEDs, this disclosure contemplates embodimentsof the thermal energy dissipating arrangement 160 that is configured toreceive and hold more or fewer LEDs or other semiconductor-basedelectrical components. In any case, as described hereinabove withrespect to FIG. 1, one or more additional thermally conductive media maybe interposed in the interface between any one or more of the openings164 ₁-164 ₉ and the outer peripheries of the electrical components 166₁-166 ₉. Examples of such additional thermally conductive media include,but are not limited to, any one or combination of conventional thermallyconductive greases and conventional thermally conductive bonding mediasuch as conventional conductive adhesives, thermally conductive epoxies,or the like.

It will be appreciated that the thermal energy dissipating sheet 152illustrated in FIGS. 10-11 generally differs from the thermal energydissipating strip 162 only in the arrangement of electrical components,e.g., LEDs, mounted thereto. In particular, FIGS. 10-11 show a matrix ofLEDs mounted to the thermal energy dissipating sheet 152, i.e., an m×narray of LEDs where m and n may be any positive integer greater than 1,whereas FIG. 12 shows a single row of LEDs mounted to the thermal energydissipating strip 162, i.e., a 1×p array of LEDs where p may be anypositive integer greater than 1. The thermal energy dissipating sheet152 may otherwise be identical to the thermal energy dissipating strip162, and as used hereinafter the term “thermal energy dissipating sheet”may be understood to generally identify a thermal energy dissipatingsheet or strip, it being understood that a “strip” in this context is asubset of a “sheet.” It will further be appreciated that any such singlerow or matrix of LEDs carried by such a thermal energy dissipating sheetor strip may be arranged linearly or non-linearly about the sheet orstrip.

Referring now to FIGS. 13A-13B, cross-sections of the thermal energydissipating arrangement 160 are shown illustrating various differentgeometries of the thermal energy dissipating medium 162. In FIG. 13A,for example, the thermal energy dissipating structure 162 illustrated inFIG. 12 is shown in which the thermal energy dissipating structure 162defines a single planar structure positioned relative to the LED 164 ₂to be substantially centrally aligned with the junction 15 of thesemiconductor circuit 102. The planar “wings” 168A and 168B of thethermal energy dissipating structure 162 are illustratively equal inlength, although in alternate embodiments the length of one wing 168A,168B may be different from the length of the other wing 168B, 168A.

Referring to FIG. 13B, a modification 162′ of the thermal energydissipating structure 162 illustrated in FIG. 12 is shown in which thethermal energy dissipating structure 162′ includes a planar region 170positioned about the LED 164 ₂ to be substantially centrally alignedwith the junction 15 of the semiconductor circuit 102. A pair of “wings”168A′ and 168B′ extend downwardly from, and at an angle relative to, theplanar region 170 on opposite sides of the LED 164 ₂. In the illustratedembodiment, the angle of each wing 168A′ and 168B′ relative to theplanar region is approximately 90 degrees, although the angle of eachwing 168A′, 168B′ relative to the planar section 170 may alternativelybe different and/or one or both may be an angle other than 90 degrees.The total length of each wing 168A′, 168B′ of the thermal energydissipating structure 162′ is illustratively equal to the other,although in alternate embodiments the length of one wing 168A′, 168B′may be different from the length of the other wing 168B′, 168A′.

Referring to FIG. 13C, another modification 162″ of the thermal energydissipating structure 162 illustrated in FIG. 12 is shown in which thethermal energy dissipating structure 162″ includes a planar region 170positioned about the LED 164 ₂ to be substantially centrally alignedwith the junction 15 of the semiconductor circuit 102. A single “wing”168A′ extend downwardly from, and at an angle relative to, the planarregion 170 on one side of the LED 164 ₂ only. In the illustratedembodiment, the angle of the wing 168A′ relative to the planar region isapproximately 90 degrees, although the angle of the wing 168A′ relativeto the planar region 170 may alternatively be different and.may be anangle other than 90 degrees.

Referring to FIG. 13D, yet another modification 162′″ of the thermalenergy dissipating structure 162 illustrated in FIG. 12 is shown inwhich the thermal energy dissipating structure 162′″ includes a planarregion 170 positioned about the LED 164 ₂ to be substantially centrallyaligned with the junction 15 of the semiconductor circuit 102. A pair of“wings” 168A′ and 168B′ extend downwardly from, and at an angle relativeto, the planar region 170 on opposite sides of the LED 164 ₂, andanother pair of wings 168A″ and 168B″ extend upwardly from, and at anglerelative to, the wings 168A′ and 168B′ respectively. In the illustratedembodiment, the angle of each wing 168A′ and 168B′ relative to theplanar region is approximately 90 degrees, and the angle of each wing168A″, 168B″ relative to the wing 168A′ and 168B′ respectively, isapproximately 180 degrees, although the angle of each wing 168A′, 168B′relative to the planar section 170 may alternatively be different and/orone or both may be an angle other than 90 degrees, and/or the angle ofeach wing 168A″, 168B″ relative to the wing 168A′ and 168B′ respectivelymay alternatively be different and/or one or both may be an angle otherthan 180 degrees. The total length of each wing 168A′, 168B′ of thethermal energy dissipating structure 162′ is illustratively equal to theother, and the total length of each wing 168A″, 168B″ is illustrativelyequal to the other. In alternate embodiments, however, the length of thewing 168A′ may be different from the length of the wing 168B′, and/orthe length of the wing 168A″ may be different from the length of thewing 168B″.

Those skilled in the art will appreciate that the thermal energydissipation structure 162 may be modified to take other forms notspecifically illustrated herein, for the purpose of providing a desiredamount of surface area, A_(S), of the thermal energy dissipating medium.It will be understood that any such other forms are contemplated by thisdisclosure.

Referring now to FIG. 14, a cross-sectional view of the embodimentillustrated in FIGS. 12 and 13A is shown illustrating the LED 164 ₂mounted to a number of juxtaposed thermal energy dissipating structures162, 162U and 162D. The thermal energy dissipating structure 162 isillustratively as described with respect to FIGS. 12 and 13A, and ispositioned relative to the LED 164 ₂ as also described with respect toFIG. 13A. This disclosure contemplates that any one or more of theelectrical components illustrated and described herein may also bemounted to one or more additional thermal energy dissipating media. Asillustrated in FIG. 14, for example, a lower thermal energy dissipationstructure 162 _(D) (shown in phantom) may be mounted to the LED 164 ₂beneath the thermal energy dissipating structure 162 to enhancerejection of thermal energy to ambient. Alternatively or additionally,an upper thermal energy dissipating structure 162 _(U) (shown inphantom) may be mounted to the LED 164 ₂ above the thermal energydissipating structure 162 to alternatively or additionally enhancerejection of thermal energy to ambient. Alternatively still, the thermalenergy dissipating structure 162 may be omitted, and the LED 164 ₂ maybe mounted only to either or both of the thermal energy dissipationstructures 162 _(U) and 162 _(D).

In embodiments in which the LED 164 ₂ is mounted to only one of thethermal energy dissipating structures 162 _(U) or 162 _(D), FIG. 14further illustrates the effect described hereinabove with misalignmentof the thermal energy dissipating structure relative to thesemiconductor junction 15. For example, if the thermal energydissipating structure 162 _(U) or 162 _(D) is positioned relative to thesemiconductor junction 15 to define an angle, θ, between the planedefined by the semiconductor junction 15 and a center point of the widthof the thermal energy dissipating structure 162 _(U) or 162 _(D), thetransfer of thermal energy from the heat source to the thermal energydissipation structure 162 _(U) or 162 _(D) will decrease by a factor ofcos θ. However, because an upper portion of the electrically conductivelead 104 also forms a lead frame to which the semiconductor circuit ismounted, at least a portion of this lead frame will be part of the heatsource. Thus, a low misalignment of the thermal energy dissipatingstructure, e.g., 162 _(D), should not decrease the transfer of thermalenergy from the heat source as much as a high misalignment of thethermal energy dissipating structure, e.g., 162 _(U), because the lowerthermal energy dissipating structure 162 _(D) is better aligned with thetotal heat source than is the upper thermal energy dissipating structure162 _(U). In any case, it is desirable for the thermal energydissipation structure to intersect the plane defined by thesemiconductor junction 15 at an angle, θ, of less than or equal to apredefined angle. For example, it is desirable for the angle, θ, to beless than or equal to about 60 degrees, it is more desirable for theangle, θ, to be less than or equal to about 45 degrees, and it is evenmore desirable for the angle, θ, to be less than equal to about 15degrees, and ideally it is desirable for the angle, θ, to be about zerodegrees such that the plane defined by the semiconductor junction 15substantially bisects the thermal energy dissipation structure.

It should be noted that the thermal energy dissipating media illustratedand described herein is in all instances separate from the lead frame orother mounting surface to which the semiconductor circuit is mounted andis electrically isolated from all voltage and/or current carryingconductive paths, i.e., it is not electrically connected in any way tothe semiconductor circuit or any voltage/current carrying conductors.However, because the thermal energy dissipating media may illustrativelybe formed from one or more electrical conductive materials, thisdisclosure contemplates that in such cases the thermal energydissipating media may, but need not, be electrically connected to theground potential.

In various embodiments shown and described herein in which thesemiconductor circuit includes an LED circuit encapsulated intransparent or otherwise light (radiation) transmissive encapsulatingmaterial, the thermal energy dissipating material is arranged to contactthe sides of the exterior surface, e.g., about the outer periphery, ofthe encapsulating material as described hereinabove. Illustratively, thethermal energy dissipating material is positioned relative to the LEDcircuit such that the thermal energy dissipating material is directlyopposite to, and generally aligned with, the plane defined by thejunction of the LED circuit. Alternatively, as illustrated and describedwith respect to FIG. 14, the thermal energy dissipating material can bepositioned such that it is offset, e.g., either higher or lower, by anangle θ relative to the plane defined by the junction of the LEDcircuit, although this may result in a reduction of thermal energydissipation by a factor of cos θ. In other alternative embodiments, asalso illustrated and described with respect to FIG. 14, the thermalenergy dissipating medium may be provided in the form of multiple, e.g.,stacked, sheets, strips, bands or rings. In any such embodiments thatinclude single or multiple layers of the thermal energy dissipatingmedium, a single surface of each thermal energy dissipating mediumhaving width W is in physical, thermally conductive contact with thesides of the encapsulating material, as the term “physical, thermallyconductive” contact is defined herein. It is only this surface of widthW that absorbs thermal energy from the LED device, and all othersurfaces of each thermal energy dissipating medium serve to reject heatto the ambient environment surrounding the thermal energy dissipatingmedium as described herein. While one or more additional, conventionalthermal energy dissipating structures may be may be used to contact theunderside of the LED device, i.e., to contact the encapsulating materialunderneath the semiconductor circuit and lead frame combination, tothereby enhance the thermal energy management of the LED device, it willbe understood that any such additional, conventional thermal energydissipating structures are generally not necessary. Rather, the variousthermal energy dissipating arrangements illustrated and described hereinsufficiently dissipate, by themselves, thermal energy generated in LEDdevices as a result of current flow therethrough, and further allow theoverall operating temperature of such LED devices to be controlled toacceptable temperature levels.

While the invention has been illustrated and described in detail in theforegoing drawings and description, the same is to be considered asillustrative and not restrictive in character, it being understood thatonly illustrative embodiments thereof have been shown and described andthat all changes and modifications that come within the spirit of theinvention are desired to be protected. For example, while some of thedrawings illustrate the thermal energy dissipating arrangementimplemented in or with one or more light emitting diodes (LEDs), it willbe understood that the thermal energy dissipating concept describedherein may be used with any semiconductor circuits, particularly thosein which current flow under typical operating conditions would raise thetemperature of the semiconductor circuit to undesirable levels in theabsence of a thermal energy dissipating arrangement as described herein.Examples of such semiconductors include, but should not be limited to,power transistors, high current driver devices, amplifiers generally andaudio amplifiers specifically, and the like.

1. A flexible thermal energy dissipating and light emitting diode (LED) mounting arrangement, comprising: a plurality of LEDs each including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface mounted to a mounting surface, and encapsulating material surrounding the LED circuit and the mounting surface, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the mounting surface and at least one side portion extending between the bottom portion and the top portion, and a flexible thermally conductive sheet defining a plurality of openings therethrough, each of the plurality of openings sized to receive and securely hold therein a different one of the plurality of LEDs with the thermally conductive sheet about the opening in physical, thermally conductive contact with the at least one side portion of the encapsulating material, the flexible thermally conductive sheet absorbing thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejecting the absorbed thermal energy to ambient, the flexible thermally conductive sheet being formable to direct radiation from the plurality of LEDs in multiple directions while securely holding each of the plurality of LEDs within a corresponding one of each of the plurality of openings.
 2. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the plurality of LEDs comprise an m×n array of LEDs arranged on the flexible thermally conductive sheet, where m and n are positive integers and where m>1 and n>1.
 3. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the plurality of LEDs comprise a p×1 array of LEDs arranged on the flexible thermally conductive sheet, where p is a positive integer and p>1.
 4. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet comprises copper (Cu).
 5. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet comprises aluminum (Al).
 6. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet comprises one or more of copper (Cu), Aluminum (Al), Gold (Au), Silver (Au), Magnesium (Mg), Tin (Sn), Zinc (Zn), Tungsten (W) and Beryllium (Be).
 7. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet is formed of a material having a thermal conductivity of at least 50 W/mK.
 8. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet is formed of a material having a thermal conductivity of at least 200 W/mK.
 9. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the thermally conductive sheet is separate from, and is not connected to, the mounting surface.
 10. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the flexible thermally conductive sheet is electrically isolated from the LED circuit.
 11. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 further comprising a high surface emissivity coating applied to one or more surfaces of the flexible thermally conductive sheet.
 12. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein an interface is defined between each of the plurality of openings defined through the flexible thermally conductive sheet and the at least one side of the encapsulating material of a corresponding one of the plurality of LEDs, and further comprising a thermally conductive medium interposed in each of the interfaces, the thermally conductive medium facilitating transfer of the thermal energy from each of the plurality of LEDs to the flexible thermally conductive sheet.
 13. The flexible thermal energy dissipating and LED mounting arrangement of claim 12 wherein the thermally conductive medium comprises at least one of a thermally conductive grease and a thermally conductive bonding medium.
 14. The flexible thermal energy dissipating and LED mounting arrangement of claim 1 wherein the LED circuit defines a semiconductor junction between the top and bottom surfaces thereof across which the current flows through the LED circuit, the semiconductor junction defining a plane that is substantially parallel with the top and bottom surfaces of the LED circuit.
 15. The flexible thermal energy dissipating and LED mounting arrangement of claim 14 wherein the flexible thermally conductive sheet about each of the plurality of openings is substantially aligned with the plane defined by the semiconductor junction of the LED circuit of each of a corresponding one the plurality of LEDs.
 16. The flexible thermal energy dissipating and LED mounting arrangement of claim 14 wherein the flexible thermally conductive sheet about each of the plurality of openings intersects an angle of less than or equal to a predefined angle relative to the plane defined by the semiconductor junction of the LED circuit of each of a corresponding one of the plurality of LEDs.
 17. The flexible thermal energy dissipating and LED mounting arrangement of claim 16 wherein the predefined angle is about 60 degrees.
 18. The flexible thermal energy dissipating and LED mounting arrangement of claim 16 wherein the predefined angle is about 45 degrees.
 19. The flexible thermal energy dissipating and LED mounting arrangement of claim 16 wherein the predefined angle is about 15 degrees.
 20. The flexible thermal energy dissipating and LED mounting arrangement of claim 16 wherein the predefined angle is about zero degrees such that the plane defined by the semiconductor junction of the LED circuit of each of the plurality of LEDs substantially bisects the flexible thermally conductive sheet about each corresponding one of the plurality of openings defined through the flexible thermally conductive sheet. 